On one side, Intel claims 18A will deliver much higher generational performance gains.
On the other, TSMC is emphasizing N2’s impressive transistor density.
But which one is truly superior?
As it turns out, the answer isn’t so straightforward.
A new report from TechInsights breaks things down, suggesting we could be in for aclosely matched competition.
When it comes to transistor density, TSMC’s N2 appears to take the lead.
However, TSMC’s advantage in density could provide an edge for certain workloads.
The comparison becomes less clear when it comes to performance projections.
While TSMC has plans for a similar approach in the future, N2 won’t include it.
However, it’s worth noting that not every 18A chip will feature this technology.
When it comes to efficiency, analysts expect N2 chips to outperform 18A and Samsung’s offerings.
TSMC has consistently led in power efficiency, so this projection aligns with recent trends.
Another key differentiator is production timelines.
Intel remains ahead, with 18A set to enter high-volume manufacturing for next-gen Core Ultra processors by mid-2025.
These chips are expected to hit shelves before the end of the year.
Additionally, Intel’s head start in production means 18A silicon will be available in real-world products much sooner.
