However, challenges remain.
He noted that early customer projects using the 18A process are nearing completion, with tape-outs anticipated by mid-2025.
Intel is also preparing to make waves in the data center market with its next-generation Xeon processors.
These processors are expected to showcase advancements in compute chiplets and packaging technologies, including Foveros Direct.
While Intel’s CPU roadmap appears strong, its GPU division faces more uncertainty.
