The chipmaker stated that thegroundbreaking ceremonyfor the new Dresden plant will be held on August 20.
TSMC Chairman and CEO C.C.
Wei, fab customers, and German government representatives are expected to attend the ceremony.
The Asian corporation is partnering with three European chip companies: NXP, Infineon, and Bosch.
Once completed in 2027, ESMC is expected to manufacture 40,000 silicon wafers each month.
Despite these economic challenges, TSMC’s expansion plans outside Taiwan are progressing.
The company and its partners are already preparing for potential futuregeopolitical scenarios.
